ProductsThermal management products

HEATEX™ High Thermal Conductive Sheet

HEATEX™ has vertically oriented thermally conductive fillers with high thermal conductivity. Above mentioned filler, which contains boron nitride has been used in the insulation series.
It can be used as an interface (TIM) to efficiently transfer the heat from heat-generating parts (CPU,LED backlight, power chip) to cooling parts (heat sink, so on..).

FlowMetal™ Nano silver paste for sintering

Typical bonding materials like solder, re-melts when exposed to high temperature.
Thus, typical solder is unusable for power semiconductors such as SiC and GaN which are used in high temperature environment.
FlowMetal™ nano silver paste is designed as a new bonding material to solve the problem.

TOPX™ Diamond Fixed Abrasive Pads

The TOPX™ diamond fixed abrasive pad is a highly efficient substrate abrasive that are designed with Bando Chemical Industries accumulated technologies in rubber and resin materials, in addition of processing, mixing, dispersion, adhesion, and molding technologies.

One of the features of the product is that it offers a very high flexibility in designing with respect to various factors such as abrasive grains size, binder type, abrasive island pattern, and blending formulation to accommodate the desired polishing rate and roughness.
It brings improvement to the processing of difficult-to-process materials and the production efficiency of current processing methods.