Notice Concerning Exhibit at the 2nd 5G/IoT Communications Expo
2019.06.26 Exhibition
(Headquarters: Kobe City, Hyogo Prefecture) will exhibit at the 2nd 5G/IoT Communications Expo to be held at Tokyo Big Sight Aomi Exhibition Hall from July 17 (Wed.) to 19 (Fri.), 2012. At this year's exhibition, we will exhibit our high thermal conductivity sheet "HEATEX ®FlowMetal, a silver nanoparticle sintering paste®Bonding Material", Substrate Lapping Pad "TOPX®and other high value-added products.
High thermal conductivity sheet
HEATEX ®.
A sheet having high thermal conductivity with vertically oriented thermally conductive filler. Our lineup of rubber sheets with the highest level of thermal conductivity in the market supports solutions to issues in thermal design, such as high power and miniaturization.
Silver nanoparticle sintering paste
FlowMetal ® Jointing Material
We will exhibit silver nanoparticle bonding materials that can be used as a solder substitute for power semiconductor chips such as Si (silicon) and SiC (silicon carbide), and as a substitute for AuSn (gold-tin) solder for LED and laser diode die, submount and package bonding. Non-pressure sintering bonding with high thermal conductivity is possible.
Substrate lapping pad
TOPX®."
High grinding rate for low-roughness substrates. Grinding/polishing pad for lapping process with both high polishing rate and low finish roughness. No-dress grinding rate maintenance. Long life contributes to reduced frequency of pad replacement (more efficient stage change).
Many other developed products will also be on display for reference.
Name: 2nd 5G/IoT Communications Expo
https://www. reedexpo. CO. jp/en/Expo/3433593/5GIoT
Duration:
Wednesday, July 17 - Friday, July 19, 2019
10:00-18:00, closing at 17:00 on the last day
Venue: Tokyo Big Sight Aomi Exhibition Hall
Our exhibit location: Hall A, Booth No. 8-26
... and upwards
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