Notice Concerning Exhibit at NANO KOREA 2019
2019.06.26 Exhibition
Bando Chemical Co., Ltd. will exhibit at NANO KOREA 2019 to be held at KINTEX Hall 4-5, Korea from July 3 (Wed.) to 5 (Fri.), 2019. At this year's exhibition, we will introduce our high value-added products such as HEATEX® high thermal conductivity sheets and FlowMetal® silver nanoparticles sintering paste for joining materials.
High thermal conductivity sheet
HEATEX ®.
A sheet having high thermal conductivity with vertically oriented thermally conductive filler. Our lineup of rubber sheets with the highest level of thermal conductivity in the market supports solutions to issues in thermal design, such as high power and miniaturization.
Silver nanoparticle sintering paste
FlowMetal ® Jointing Material
We will exhibit silver nanoparticle bonding materials that can be used as a solder substitute for power semiconductor chips such as Si (silicon) and SiC (silicon carbide), and as a substitute for AuSn (gold-tin) solder for LED and laser diode die, sub-mount and package bonding.
Non-pressure sintering bonding with high thermal conductivity is possible.
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