Notice of Exhibit at "NEPCON JAPAN 2020/21st ELECTRONIC COMPONENTS & MATERIALS EXPO
2019.12.23 Exhibition
(Headquarters: Kobe, Hyogo, Japan) will exhibit at "NEPCON JAPAN 2020/21st Electronic Components & Materials EXPO" to be held at Tokyo Big Sight from January 15 (Wed.) to 17 (Fri.), 2020.
The exhibit will feature HEATEX, a high thermal conductivity sheet®(Heat Ex)", silver nanoparticle product "FlowMetal®(flow metal) bonding materials and inks, and TOPX precision abrasives ®(Top X)".
High thermal conductivity sheet
HEATEX®.
The anisotropic filler orientation provides unprecedented high thermal conductivity. In addition to insulating and conductive specifications, we have added low-hardness (flexible) specifications to our product lineup, and will propose products that meet the thermal issues of the application you are considering.
Silver Nanoparticle Products
FlowMetal® Bonding Material and Ink
As a silver bonding material using nanoparticles, it supports chip-to-substrate bonding during high-temperature semiconductor drive. Even under repeated thermal fatigue and distortion caused by thermal expansion, the material exhibits low elastic modulus from the nanoparticles and low electrical resistance from the silver, resulting in improved reliability and low loss.
As conductive silver ink using nanoparticles, we offer a lineup of inks for various printing methods. We offer inks that are mainly water-based and organic solvents, which exhibit low-temperature firing and low resistance, and that are suitable for the printing method and the base material.
Precision abrasives
TOPX ®."
Polishing pads for lapping processes that achieve both high polishing rates and low finish roughness, independent of pre-process surface roughness, through binder property control technology, dispersion technology, and wear control technology. We offer polishing pads and processes for a wide variety of use conditions, including brittle and difficult-to-machine materials.
Name: NEPCON JAPAN 2020/21st Electronic Components & Materials Expo
Organizer: Reed Exhibitions Japan Ltd.
Duration:
January 15 (Wed.) - 17 (Fri.), 2020
Venue: Tokyo Big Sight, South Exhibition Hall 4F S21-20
... and upwards
The information on this page is current as of the date of publication, and may be different from the information available at the time of your visit. Please be aware that the information may differ from the information on this page at the time of your visit.