Notice Concerning the Launch of "FlowMetal®" for Opto-semiconductors
2020.05.29 Other
(Headquarters: Kobe, Hyogo, Japan) announces the release of FlowMetal®, a silver nanoparticle bonding material for low-temperature sintering of die and submounts for optical semiconductors such as light-emitting diodes (LEDs) and laser diodes.
1. Background and Aim of Development
In the opto-semiconductor industry, in addition to conventional lighting applications, LEDs and laser diodes are being used in optical devices for various industrial equipment applications that use high-power light sources. In particular, ultraviolet LEDs generate a large amount of heat, and because thermal countermeasures are inevitable, high thermal conductivity is also required for bonding materials for light-emitting elements. To meet this need, we have developed FlowMetal®, a silver nanoparticle bonding material that combines low-temperature sintering without pressure, a dense sintered layer, and high thermal conductivity, through the design of silver nanoparticles and dispersants based on our core technology of rubber and resin material dispersion.
2. New Product Features
(1) While the need to heat at high temperatures to remove dispersants has been a problem with conventional products, our proprietary compound design enables low-temperature sintering without pressurization, as well as dense sintered layers and high thermal conductivity.
Firing temperature: 150 to 280 °C
Thermal conductivity after firing: 140 to 250 W/mK
(2) In addition to LED and laser diode die and submount, it can be used as a solder substitute for Si (silicon), SiC (silicon carbide) and other power semiconductor chip junction solder, and as a substitute for AuSn (gold-tin) solder in package junction.
Silver nanoparticle bonding material "FlowMetal®".
Low temperature sintering type bonding material consisting of silver nanoparticles coated with a dispersing agent and a solvent.
Silver nanoparticles sinter at a much lower temperature than silver's inherent melting point (approx. 962°C) due to the nano-size effect. After sintering, the temperature returns to silver's inherent melting point, thus ensuring high reliability as a bonding material.
... and upwards
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