HEATEX™ High thermal conductive sheet

Features

1. Various specifications of insulation.
2. High thermal conductivity, one of the highest on the market.
3. A rubber type soft sheet TIM without being over adhesive.＊
(＊) TIM : Thermal Interface Material

Vertical orientation control of thermal conductive filler

Magnified cross-sectional view of high thermal conductivity sheet

Electron micrograph of the cross-sectional structure of HEATEX™ with vertically oriented boron nitride

Handling

Highly thermally conductive heat-dissipating sheet that is resistant to cracking even when bent

Silicone rubber as the material, it is hard to break even when bent, has a silky feel to it, and has excellent workability.
Rework is also possible.
Adhesive treatment of the sheet surface is available as an option.

Thermal Stability

Maintains low thermal resistance in pressurized environments.
Even if it is used for a long time in an environment of 200°C, there is almost no change in physical properties.
In addition, the pump-out phenomenon caused by thermal paste is less likely to occur.

*Pump-out phenomenon
As materials expand and contract repeatedly due to the rise and fall of the temperature, the grease which was in contact with the materials will be pushed out, thus creating the pump-out phenomenon.
When the pump-out phenomenon occurs, the contact thermal resistance increases due to the formation of gaps, hence the initial efficiency cannot be attained.

Specifications

	Unit	Standard		TS103			TS107
General Characteristics
Color	－	Visual		Gray			Rose Gray
Size	mm	－		100 x 100			100 x 100
Thickness	mm	－		0.3	0.5	1.0	0.3	0.5	1.0
Density	g/cm³	JIS K6220		1.6			1.6
Hardness	－	Asker C		70			55
Continuous operating temperature	℃	－		-40 to 150			-40 to 150
Compression ratio	%	Test Piece T=1㎜ Φ33㎜	0.3MPa	３			４
			0.5MPa	５			11
			1.0MPa	19			35
Electrical Characteristics
Volume resistivity	Ω-ⅽm	JIS K6911		＞10¹³			＞10¹³
Dielectric constant	－	JIS C2138	1 MHz	3.5			3.5
			2 MHz
Dielectric tangent	－	JIS C2138	1 MHz	＜0.001			＜0.001
			2 MHz
Breakdown Voltage	kV/mm	Test Piece T=1mm1kV/s, Air Condition		＞20			＞20
Thermal conductivity
Thermal conductivity	W/m-K	ISO 22007-3		17			17
		ASTMD5470		９			９
Thermal Resistance 25°C 0.5MPa	Kcm²/W	ASTM D5470	0.3㎜	0.4			0.4
			0.5㎜	0.6			0.6
			1.0㎜	1.1			1.1
Flame retardant properties
Flame resistance	－	UL94		V-0 Equivalent			V-0 Equivalent
Other Characteristics
Low molecular siloxane content	ppm	∑D4-D10		＜300			＜300

The values in the table are representative values. Specifications are subject to change without notice.

The above table data is also stored in Catalogs and Documents, and can be downloaded as a PDF file.

Applications

Image of HEATEX™ in use

Applications & Cases

Introducing our product applications and cases for various industries.

Bonding material usable at high temperatures where solder cannot be used

This is a bonding material in the form of a paste containing silver nanoparticles. After heating, the paste becomes a sintered body, but it exhibits the same performance (heat resistance, electrical conductivity, thermal conductivity, etc.) as bulk silver and achieves high shear strength.

Thermal conductive sheet to dissipate heat generated by heat-generating parts

Vertical orientation of the thermally conductive filler increases the heat transfer path, resulting in a high thermal conductivity.

Bando Chemical's "Thermal Management" special site

Bando Chemical's "Thermal Management"

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