Bonding material usable at high temperatures where solder cannot be used
- #Thermal management
- #Semiconductor, Electronic parts production equipment
- #Power semiconductors
- #Thermal management products
Ideal bonding material for power semi-conductor dies where solder cannot be used
This is a bonding material in the form of a paste containing silver nanoparticles. After heating, the paste becomes a sintered body, but it exhibits the same performance (heat resistance, electrical conductivity, thermal conductivity, etc.) as bulk silver and achieves high shear strength.
- #Thermal management
- #Semiconductor, Electronic parts production equipment
- #Power semiconductors
- #Thermal management products