Features
・A bonding material using our unique silver nanoparticles.
We manufacture nano silver paste for bonding materials using silver nanoparticles synthesized by our company.
Higher silver particle concentration (85-97wt%) is possible.
Lead-free.
・Low bonding temperature and excellent heat resistance, electrical conductivity, thermal conductivity.
The low-temperature baking type silver nanoparticle production technology has been applied to enable sinter bonding at low temperatures.
It is known that silver nanoparticles sinter at low temperature due to the size effect, and the melting point of the sintered silver is similar to that of bulk silver (962℃).
・Pressure-free bonding
In spite of pressure-free bonding, the low-temperature sintering process provides high bonding strength through diffusion reactions between the nanoparticles and the substrate metal.
Depending on the bonding conditions, pressure-free bonding may not be suitable. There is also a lineup that enables pressure welding.
Printing Method
Dispensing, metal mask (stencil) printing, and pin transfer are available.
Required surfaces
Gold, Silver, Copper
Product Lineup
The values in the table are representative values. Specifications are subject to change without notice.
Applications
Example of printing on a semiconductor die
Applications & Cases
Introducing our product applications and cases for various industries.
