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FlowMetal™ Nano silver paste for sintering

Nano silver paste for die attach process which can be bonded at low temperatures

Typical bonding materials like solder, re-melts when exposed to high temperature.

Thus, typical solder is unusable for power semiconductors such as SiC and GaN which are used in high temperature environment.
FlowMetal™ nano silver paste is designed as a new bonding material to solve the problem.

Although the sintered body of silver nanoparticles is dense with small number of pores in the structure, it retains low electrical resistance and high thermal conductivity almost as the same as silver.

FlowMetal™ Nano silver paste for sintering

Özellikler

・A bonding material designed using our exclusive silver nanoparticles.
FlowMetal™ nano silver paste is manufactured using silver nanoparticles synthesized by our company.
Specifications with higher silver particle concentration (85-97wt%) are available.
The product is lead-free.

・Low bonding temperature with excellent heat resistance, electrical conductivity, thermal conductivity.
Production technology of low-temperature sintering type silver nanoparticle enables sinter bonding of the nano silver paste at low temperatures.
It is known that silver nanoparticles sinter at low temperature due to the size effect, and the melting point of the sintered silver is similar to that of bulk silver (962℃).

・Pressure-less sintering
 In spite of being pressure-less, the low-temperature sintering process provides high bonding strength through diffusion reactions between the nanoparticles and the substrate metal.
Pressure-free sintering may not be suitable depending on the conditions. There is also specifications for sintering with pressure.

Baskı Yöntemi

Dispenser, metal mask (stencil) printing, or pin transfer process are available.

Applicable Surfaces

Altın, Gümüş, Bakır

Product Specifications

SR9200

SR9870

(Under development)

SR9950

Özellikler

Düşük sinterleme sıcaklığı.

Pressure-less sintering to bare Cu surface

Düşük sinterleme sıcaklığı.

Medium die size

Uygulamalar LED, UV-LED, LD

Power semiconductor (Si、SiC)

Power semiconductor (Si、SiC)

Küçük Kalıplar

(~1,5 mm×1,5 mm)

Büyük Kalıplar

(~10mm×10mm)

Medium Dies

(~5mm×5mm)

Applicable Surface Tarım, Avustralya Tarım, Altın, Bakır Tarım, Avustralya

İşlem

Conditions

Baskı Yöntemi

Dağıtıcı

Pin transfer process

Metal maske baskısı Dağıtıcı

Sinterleme

Atmosphere

Hava

Nitrogen or Air

Hava

Sinterleme

Temperature (ºC)

150 275 200

Sintering Time

(dakika)

120 30 60
Sintering Pressure Pressure-less Pressure-less Pressure-less

Özellikler

sonrasında

Sinterleme

Shear Strength

(MPa)

>70

(1mm×1mm)

>90

(2,5 mm × 2,5 mm)

>120

(3mm×3mm)

Termal

Conductivity

(W/mK)

140 300 215

Electric Resistivity

(μΩcm)

5 2 3

Tablodaki değerler temsili değerlerdir. Özellikler önceden haber verilmeksizin değiştirilebilir.

Uygulamalar

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