FlowMetal™ | Nano silver paste for sintering

Features

・A bonding material designed using our exclusive silver nanoparticles.
FlowMetal™ nano silver paste is manufactured using silver nanoparticles synthesized by our company.
Specifications with higher silver particle concentration (85-97wt%) are available.
The product is lead-free.

・Low bonding temperature with excellent heat resistance, electrical conductivity, thermal conductivity.
Production technology of low-temperature sintering type silver nanoparticle enables sinter bonding of the nano silver paste at low temperatures.
It is known that silver nanoparticles sinter at low temperature due to the size effect, and the melting point of the sintered silver is similar to that of bulk silver (962℃).

・Pressure-less sintering
　In spite of being pressure-less, the low-temperature sintering process provides high bonding strength through diffusion reactions between the nanoparticles and the substrate metal.
Pressure-free sintering may not be suitable depending on the conditions. There is also specifications for sintering with pressure.

Printing Method

Dispenser, metal mask (stencil) printing, or pin transfer process are available.

Applicable Surfaces

Gold, Silver, Copper

Product Specifications

		SR9200	SR9870 (Under development)	SR9950
Features		Low sintering temp.	Pressure-less sintering to bare Cu surface	Low sintering temp. Medium die size
Applications		LED, UV-LED, LD	Power semiconductor (Si、SiC)	Power semiconductor (Si、SiC)
Applications		Small Dies (～1.5mm×1.5mm)	Large Dies (～10mm×10mm）	Medium Dies (～5mm×5mm）
Applicable Surface		Ag, Au	Ag, Au, Cu	Ag, Au
Process Conditions	Printing Method	Dispenser Pin transfer process	Metal mask printing	Dispenser
	Sintering Atmosphere	Air	Nitrogen or Air	Air
	Sintering Temperature (ºC)	150	275	200
	Sintering Time (min)	120	30	60
	Sintering Pressure	Pressure-less	Pressure-less	Pressure-less
Properties after Sintering	Shear Strength (MPa)	>70 （1mm×1mm）	>90 （2.5mm×2.5mm）	>120 （3mm×3mm）
	Thermal Conductivity (W/mK)	140	300	215
	Electric Resistivity (μΩcm)	5	2	3

The values in the table are representative values. Specifications are subject to change without notice.

Applications

Example of printing on a semiconductor die

Applications & Cases

Introducing our product applications and cases for various industries.

Bonding material usable at high temperatures where solder cannot be used

This is a bonding material in the form of a paste containing silver nanoparticles. After heating, the paste becomes a sintered body, but it exhibits the same performance (heat resistance, electrical conductivity, thermal conductivity, etc.) as bulk silver and achieves high shear strength.

Bando Chemical's "Thermal Management" special site

Bando Chemical's "Thermal Management"

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